Creditcall And NXP Announce EMV Kernel Collaboration

Delivers faster, cheaper, easier path to market for PED manufacturers

Creditcall, the EMV-ready payment gateway provider and EMV Migration specialist, recently announced a new collaboration with NXP Semiconductors N.V., ahead of Smart Card Alliance’s Payment Summit in Salt Lake City, Utah on February 3-5.

Creditcall will combine an evaluation version of its EMV Level 2 Contact and Contactless Kernels with NXP’s range of proven payment-compliant smart card interfaces in a convenient hardware and software reference demonstrator for secure near field communication (NFC)-enabled Mobile Point of Sale (mPOS) solutions. The EMV Kernels are the software components that control communication between an EMV chip card terminal and contact or contactless EMV chip card.

Market Leaders Bring Enhanced Usability and Profitability to Manufacturing

The collaboration will enable PIN Entry Device (PED) manufacturers to test the feasibility of using both technologies in their own designs in order to dramatically reduce risk, cost and time to market.

With more than 15 years EMV experience and one million Creditcall EMV Kernels deployed worldwide in ATMs, PINpads, mPOS solutions, parking payment terminals, vending machines, kiosks and a multitude of other devices, Creditcall’s EMV Kernels are recognized as the most adopted, deployed and trusted in the world.

NXP Semiconductors is a $4.82B global company with operations in more than 25 countries and is the largest supplier of contact and contactless interfaces for PEDs and secure smart card controllers for payment applications.

Paul Hubmer, General Manager, NFC reader solutions, NXP Semiconductors said, “Partnering with Creditcall allows us to reach new markets with our new mPOS demonstrator, giving customers access to an extremely impressive range of contact and contactless EMV Level 2 Kernels. Mobile point-of-sale units not only provide merchants and retailers increased opportunity to sell, they also offer consumers a new simplicity and freedom in payment options.”

“This collaboration is a strategic win for all as it provides a more complete EMV offering to PED manufacturers than has previously existed, said Jeremy Gumbley, Chief Technology Officer at Creditcall. ”By combining two of the most reputable solutions in the world from Creditcall and NXP, PED manufacturers worldwide now have access to a risk free path to EMV which is faster, easier and more cost effective.”

Engage with Subject Matter Experts at Smart Card Alliance’s Payment Summit

Creditcall and NXP will be launching and promoting their collaboration at booth #14 at Payment Summit in Salt Lake City on February, 3-5, 2015 with Creditcall’s representatives available on site for questions. Creditcall’s CTO Jeremy Gumbley will be presenting, “How EMV and P2PE can secure Card Present Transactions,” in the session, Managing Threats and Mitigating Risks of Future Data Breaches on February, 4 at 3:15 – 4:15 MT.

About NXP Semiconductors
NXP Semiconductors N.V. creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82B in 2013. For more information, visit www.nxp.com.

About Creditcall
Creditcall makes card acceptance simple from any device, anywhere. Whether attended, unattended, online or mobile payments, our award-winning EMV-ready payment gateway and EMV Migration solutions have been tried and tested for over 15 years and are at the very heart of our clients’ businesses, ensuring payments flow – all day, every day. Founded in 1996, Creditcall is a global business with offices in North America and Europe.

For more information, visit www.creditcall.com.